Foxconn showcased its expanding role in artificial intelligence (AI) infrastructure at its annual technology event in Taipei, highlighting a modular data center built around Nvidia’s Vera Rubin platform alongside new electric vehicle (EV) designs and smart healthcare applications.AI infrastructure takes center stageHon Hai Technology Group (Foxconn) placed AI infrastructure at the center of its annual Hon Hai Tech Day (HHTD26), held on Oct. 30–31 at the Taipei Nangang Exhibition Center.Under the theme “Accelerating Intelligence,” the seventh edition of the event featured 321 exhibits spanning AI computing, precision manufacturing, electric vehicles, robotics and smart healthcare, reflecting the company’s efforts to extend its manufacturing capabilities into a broader range of technology services. The 2026 theme Accelerating Intelligence is displayed. (TCN) One of the event’s principal attractions was a modular container based on Nvidia’s DSX POD reference design, which enables partners to integrate a complete Nvidia Vera Rubin AI factory before delivering it to customers.The system brings together computing infrastructure and supporting components in a factory-built environment, with integration and validation completed before shipment.According to Foxconn, the units arrive ready to connect to a prepared site's power, cooling, networking and other supporting infrastructure, reducing deployment time from six months to as little as 14 days. The systems undergo rack-to-rack cabling, wiring, piping and functional validation before shipment.The showcase also highlighted the importance of integrating power and thermal management into AI infrastructure.Foxconn presented an immersive simulation of an AI data hall, demonstrating how computing, networking, power and cooling systems are co-designed for an AI factory, including Nvidia's 800-volt direct-current (800 VDC) power distribution architecture. Participants learn about the Nvidia Vera Rubin platform at the event. (TCN) Building an integrated AI infrastructure ecosystemThe AI infrastructure displays extended beyond Foxconn’s own collaboration with Nvidia.Taipei-based electromechanical manufacturer TECO also presented a modular data center concept developed in cooperation with Foxconn and based on the Nvidia DSX POD reference design.Housed in a 40-foot container, the system integrates IT racks, cooling systems and power distribution equipment.The demonstration highlighted TECO’s one-stop integration and delivery capabilities, combining critical equipment with electromechanical engineering.The two Taiwanese companies established a strategic alliance through an equity swap in 2025 and have continued to deepen their cooperation in response to growing demand for AI computing infrastructure. Halloween decorations are presented alongside the products of TECO and Foxconn. (TCN) Across the exhibition, Foxconn highlighted its vertical integration and precision manufacturing capabilities, ranging from rack-level AI supercomputing system integration to sub-micron-level component manufacturing.Among the event’s record 321 exhibits, the Token Factory zone accounted for approximately one-quarter.A 20-meter display wall presented printed circuit boards (PCBs) mounted with tens of thousands of micron-level precision-engineered components.Other exhibits featured a cable-free, hose-free and fanless AI server compute tray, co-packaged optics (CPO), and redesigned power, cooling and high-speed data solutions for more efficient AI infrastructure.Expanding its electric vehicle portfolioFoxconn also unveiled three new electric vehicle reference models: the MODEL A+, MODEL K+ and MODEL K. The additions bring the company’s EV portfolio to 12 reference models, five years after it first introduced an electric vehicle prototype.The three models target different market segments.The MODEL A+ is positioned as a luxury SUV targeting affluent drivers, with features designed to support emergency situations and outdoor lifestyles.The MODEL K+ is positioned as an affordable, lifestyle-oriented SUV designed for younger consumers. The MODEL K, meanwhile, is a compact commercial truck designed for last-mile delivery and mobility-service applications. Its introduction extends Foxconn’s EV portfolio into Japan’s kei-class truck segment.The company presented the vehicles as part of its Contract Design and Manufacturing Service (CDMS) strategy, through which it aims to provide automotive clients with flexible vehicle design and manufacturing solutions.Representatives from Honda R&D and Mitsubishi Electric Mobility also delivered separate presentations on their respective electromobility developments with Foxconn.There was also a test-ride area at the exhibition where participants could experience the vehicles firsthand. Participants get on an electric vehicle for a test ride. (TCN) Bringing AI and robotics into healthcareSmart healthcare formed another major part of the exhibition, with Foxconn showcasing applications spanning clinical AI, digital twins and hospital robotics.One featured system was CoDoClaw, Foxconn’s Clinical AI Orchestrator, jointly developed with Tung’s Taichung MetroHarbor Hospital.According to Foxconn, by integrating multimodal medical models with agentic AI, the platform connects data and AI capabilities across medical specialties and healthcare systems, with a focus on diabetes and cardiometabolic multimorbidity management.Foxconn also showcased an Integrated Chemotherapy Compounding and Delivery System developed in collaboration with Taipei Veterans General Hospital, Kawasaki Heavy Industries, Yuyama Manufacturing and FARobot.Using Nvidia Omniverse libraries, Foxconn builds digital twins to simulate and evaluate chemotherapy compounding, robotic transportation and delivery workflows before deployment.The system integrates ChemoRo the Spike automated chemotherapy compounding equipment, FARobot autonomous mobile robots and Foxconn’s Nurabot nursing collaborative robot, coordinating the process from drug compounding and transportation to clinical delivery.Together, these demonstrations illustrated Foxconn’s efforts to extend AI and robotics beyond conventional manufacturing and into healthcare environments, where digital systems, medical equipment and hospital workflows must operate in coordination. Foxconn demonstrates a product used for smart healthcare. (TCN) From electronics manufacturer to technology platform providerThe breadth of the exhibition reflected Foxconn Chairman Young Liu’s (劉揚偉) description of the company’s evolving business model. “Foxconn is transforming into a technology manufacturing platform service provider,” Liu said.He pointed to the group’s vertical integration and precision manufacturing capabilities across smart consumer electronics, AI, electric vehicles, space and robotics.The exhibition demonstrated how Foxconn is applying these capabilities across an increasingly diverse range of technology sectors. From AI server manufacturing and modular data center integration to electric vehicles and healthcare robotics, the company showcased how its engineering expertise and partnerships can support the development of complex technology systems.As demand for AI infrastructure grows, Foxconn is seeking to extend its role beyond hardware manufacturing.Its displays of integrated AI computing, power distribution and cooling systems illustrated the company’s ambition to provide broader infrastructure solutions, combining manufacturing capabilities with system integration and engineering expertise.